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Trường DC | Giá trị | Ngôn ngữ |
---|---|---|
dc.contributor.author | Xiangyu, Lei | - |
dc.contributor.author | Håkan, Wirdelius | - |
dc.contributor.author | Johan E., Carlson | - |
dc.date.accessioned | 2023-04-18T02:18:10Z | - |
dc.date.available | 2023-04-18T02:18:10Z | - |
dc.date.issued | 2023 | - |
dc.identifier.uri | https://link.springer.com/article/10.1007/s10921-023-00949-7 | - |
dc.identifier.uri | https://dlib.phenikaa-uni.edu.vn/handle/PNK/8019 | - |
dc.description | CC BY | vi |
dc.description.abstract | As the demand of structural integrity in manufacturing industries is increasing, the ultrasonic array technique has drawn more attention thanks to its inspection flexibility and versatility. By taking advantage of the possibility of individual triggering of each array element, full matrix capture (FMC) data acquisition strategy has been developed that contains the entire information of an inspection scenario. Total focusing method (TFM) as one of the ultrasonic imaging algorithms, is preferably applied to FMC dataset since it uses all information in FMC to synthetically focus the sound energy at every image pixel in the region of interest. Half-skip TFM (HSTFM) is proposed in multi-mode TFM imaging that involves a backwall reflection wave path, so that the defect profile could be reconstructed for accurate defect | vi |
dc.language.iso | en | vi |
dc.publisher | Springer | vi |
dc.subject | Total focusing method | vi |
dc.subject | HSTFM | vi |
dc.title | Model-Based Parametric Study of Surface-Breaking Defect Characterization Using Half-Skip Total Focusing Method | vi |
dc.type | Book | vi |
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OER - Kỹ thuật điện; Điện tử - Viễn thông |
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